Electronic module assembly apparatus, methods and articles of manufacture

Apparatus, methods and articles of manufacture for electronic module assemblies are shown, comprising a pin organizer installed after a header is assembled to a module. Opposing forces tension the organizer, header and module assembly, so as to provide a relatively fixed anchor for the header upon t...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KANE VINCENT M, FOLTZ KEITH R
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Apparatus, methods and articles of manufacture for electronic module assemblies are shown, comprising a pin organizer installed after a header is assembled to a module. Opposing forces tension the organizer, header and module assembly, so as to provide a relatively fixed anchor for the header upon the module, as well as providing orientation for the module and support for a pin array.