Method and apparatus for reconfiguring circuit board and integrated circuit packet arrangement with one-time programmable elements

An arrangement and method of reconfiguring a circuit board and package arrangement employs one-time programmable elements on a package to allow a programmable first package arrangement having a first package board and a first integrated circuit to be readily replaced. The first package arrangement was programmed to operate with a first set of operating parameters. The replacement package arrangement, having a second package board and a second integrated circuit, may be substantially identical to the first package arrangement except programmed to operate with a second set of operating parameters different from the first set of op crating parameters. The replacement of the first package arrangement by the second, differently programmed package arrangement, provides a reconfigured circuit board and package arrangement while avoiding the obsoleting of the circuit board.