Method of forming an assembly of stacked layers

Method of forming an assembly of stacked layers

In an assembly of layers, a first layer has a recess, a second layer is deposited over the first layer, and a third layer is deposited over the second layer and fills the recess. The material of the third layer is less wear resistant than the second layer. After forming the second layer, the assembl...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: THEUNISSEN GERARDUS S. A. M, VAN ZON JOANNES B. A. D
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INFORMATION STORAGE
INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER
PHYSICS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:In an assembly of layers, a first layer has a recess, a second layer is deposited over the first layer, and a third layer is deposited over the second layer and fills the recess. The material of the third layer is less wear resistant than the second layer. After forming the second layer, the assembly is polished to create a flat and smooth surface. The polishing is stopped upon reaching the second layer.