Methodology to obtain integrated process results prior to process tools being installed

In accordance with the objectives of the invention a new methodology is provided that assures that integrated process results are verified and assured prior to the installation of processing tools as part of modifying or updating of a semiconductor manufacturing foundry. The complete semiconductor m...

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Bibliographische Detailangaben
Hauptverfasser:	HOON CHO NAM, WONG GEORGE, KONG LEONG CHEE, CHAM JOHNNY, EE NEOH SOON, SHU CHENG CHOR, BENYON PETE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS COMPUTING CONTROL OR REGULATING SYSTEMS IN GENERAL CONTROLLING COUNTING DATA PROCESSING SYSTEMS OR METHODS, SPECIALLY ADAPTED FORADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL, SUPERVISORYOR FORECASTING PURPOSES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL ELEMENTS OF SUCH SYSTEMS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS PHYSICS REGULATING SEMICONDUCTOR DEVICES SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE,COMMERCIAL, FINANCIAL, MANAGERIAL, SUPERVISORY OR FORECASTINGPURPOSES, NOT OTHERWISE PROVIDED FOR TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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Beschreibung
Zusammenfassung:	In accordance with the objectives of the invention a new methodology is provided that assures that integrated process results are verified and assured prior to the installation of processing tools as part of modifying or updating of a semiconductor manufacturing foundry. The complete semiconductor manufacturing complement of processing tools is sub-divided into short-loops or sub-modules, which are then combined into a full loop. This combination of sub-modules into modules that closer approach a full complement of processing tools can be accomplished in a gradual manner, whereby one or more sub-loops are first combined and evaluated, to this combination one or more additional sub-groups may be added whereby each of these latter sub-groups may also have been created by combining one or more (original) sub-loops. This process is continued to the point where a full complement of process equipment has been created, completing the full processing loops of the semiconductor manufacturing facility.