Process for fabricating ball grid array package for enhanced stress tolerance

The thermomechanical stress sensitivity of ball grid array (BGA) solder connections is significantly reduced, when the solder connections solidify in column-like contours after the reflow process-a result achieved by using the solder material in tapered openings of a thick sheet-like elastic polymer...

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Bibliographische Detailangaben
Hauptverfasser:	STARK LESLIE E, JAMES RICHARD D
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The thermomechanical stress sensitivity of ball grid array (BGA) solder connections is significantly reduced, when the solder connections solidify in column-like contours after the reflow process-a result achieved by using the solder material in tapered openings of a thick sheet-like elastic polymer adhered to the BGA substrate and selected for its characteristics of non-wettability to solder and volumetric shrinkage greater than solder.