Passive self-alignment technique for array laser transmitters and receivers for fiber optic applications

An active optical device having a plurality of optical receiving or transmitting elements is secured to a carrier having two holes adapted to receive respective alignment pins of the connector. The optical device is secured to the carrier by a first solder ball contract array pattern on a surface of the optical device substrate and a second matching solder ball contact array pattern on a surface of the carrier. Solder balls disposed between the first solder ball contact array pattern of the optical device substrate and the second solder ball contact array pattern are melted so that solder reflow self-aligns the patterns, and further positions the optical device array in a predetermined orientation with respect to the alignment holes in the carrier. A flexible electrical interconnect member having a plurality of electrical traces is coupled to the active optical device at one of its ends and the other end is available for coupling to another device.