Dual access instruction and compound memory access instruction with compatible address fields
A processing engine 10 includes an instruction buffer 502 operable to buffer single and compound instructions pending execution. A decode mechanism is configured to decode instructions from the instruction buffer. The decode mechanism is arranged to respond to a predetermined tag in a tag field of a...
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Sprache: | eng |
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Zusammenfassung: | A processing engine 10 includes an instruction buffer 502 operable to buffer single and compound instructions pending execution. A decode mechanism is configured to decode instructions from the instruction buffer. The decode mechanism is arranged to respond to a predetermined tag in a tag field of an instruction, which predetermined tag is representative of the instruction being a compound instruction formed from separate programmed memory instructions. The decode mechanism is operable in response to the predetermined tag to decode at least first data flow control for a first programmed instruction and second data flow control for a second programmed instruction. The use of compound instructions enables effective use of the bandwidth available within the processing engine. A soft dual memory instruction can be compiled from separate first and second programmed memory instructions. A compound address field of the predetermined compound instruction can be arranged at the same bit positions as the address field for a hard compound memory instruction, that is a compound instruction which is programmed. In this case the decoding of the addresses can be started before the operation code of the instructions have been decoded. To reduce the number of bits in the compound instruction, addressing can be restricted to indirect addressing and the operation codes for at least the first instruction can be reduced in size. In this way, the compound instruction can be arranged to have the same number of bits in total as the sum of the bits of the separate programmed instructions. |
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