Method for fabricating semiconductor device

A peeling film is deposited on an insulating film, which is formed on a semiconductor substrate and has a hole, and on the bottom and the wall of the hole so as not to fill the hole with the peeling film. A resist film is formed over the peeling film so as to fill the hole. A resist pattern is forme...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	KANEGAE KENSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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