Method of producing alignment marks

Alignment marks (overlay marks or alignment markers) are produced in a semiconductor structure with integrated circuits. Contact holes and alignment trenches are etched into an insulator layer and in each case open out at a first metal layer at their undersides. Metal is deposited into the alignment...

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Bibliographische Detailangaben
Hauptverfasser:	EBERTSEDER EVA, PAHLITZSCH JUERGEN, LEHR MATTHIAS, WERNEKE TORSTEN, HANEBECK JOCHEN
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Alignment marks (overlay marks or alignment markers) are produced in a semiconductor structure with integrated circuits. Contact holes and alignment trenches are etched into an insulator layer and in each case open out at a first metal layer at their undersides. Metal is deposited into the alignment trenches and the contact holes. With a subsequent chemical mechanical polishing procedure, the metal areas are lowered in the region of the alignment trenches and form profiles for the alignment marks in a second metal layer, which is deposited on the insulator layer.