Composition for removing side wall and method of removing side wall

A composition for removing side wall which includes an aqueous solution containing both nitric acid and at least one of carboxylic acids selected from the group consisting of polycarboxylic acid, aminocarboxylic acid, and salts thereof; a method of removing side wall; and a process for producing a s...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SUGIYAMA TSUTOMU, MIYAHARA KUNIAKI, OGATA FUJIMARO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A composition for removing side wall which includes an aqueous solution containing both nitric acid and at least one of carboxylic acids selected from the group consisting of polycarboxylic acid, aminocarboxylic acid, and salts thereof; a method of removing side wall; and a process for producing a semiconductor device. Use of the composition is effective in removing side wall at a low temperature in a short time in semiconductor device production without corroding the wiring material, e.g., an aluminium alloy. Thus, a semiconductor device having an aluminium alloy wiring which has undergone substantially no corrosion can be efficiently produced.