Electronic assembly comprising substrate with embedded capacitors

Electronic assembly comprising substrate with embedded capacitors

To reduce switching noise, the power supply terminals of an integrated circuit die can be coupled to the respective terminals of at least one embedded capacitor in a multilayer ceramic substrate. In one embodiment, the capacitor is formed of at least one high permittivity layer. In another embodimen...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: CHAKRAVORTY KISHORE K
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:To reduce switching noise, the power supply terminals of an integrated circuit die can be coupled to the respective terminals of at least one embedded capacitor in a multilayer ceramic substrate. In one embodiment, the capacitor is formed of at least one high permittivity layer. In another embodiment, several high permittivity layers are interleaved with conductive layers. Alternatively, the capacitor can comprise at least one embedded discrete capacitor. Also described are an electronic system, a data processing system, and various methods of manufacture.