Connection structure for display module and printed substrate, semiconductor device, display module, and electronic component

A connection structure for connecting a display module and a printed substrate is provided, which is appropriate for use in mass production of electronic devices such as a cellular phone in which, while a thin mounting is desired, many components have to be mounted on the printed substrate and the d...

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Bibliographische Detailangaben
Hauptverfasser:	TOMOKUNI HIROAKI, SATOU KUNIHIRO, CHIKAWA YASUNORI
Format:	Patent
Sprache:	eng
Schlagworte:	ADVERTISING BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CRYPTOGRAPHY CURRENT COLLECTORS DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING DISPLAY DISPLAYING EDUCATION ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING LABELS OR NAME-PLATES LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS PRINTED CIRCUITS SEALS SIGNS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF TELEPHONIC COMMUNICATION
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Beschreibung
Zusammenfassung:	A connection structure for connecting a display module and a printed substrate is provided, which is appropriate for use in mass production of electronic devices such as a cellular phone in which, while a thin mounting is desired, many components have to be mounted on the printed substrate and the display module is required to be mounted in predetermined space on the printed substrate. The liquid crystal module is provided with a pin electrode on an external connection terminal of its COF, and fixed to a housing in a folded state with respective rear surfaces of the COF and a liquid crystal panel facing each other. A holding member for engaging the printed substrate and holding the printed substrate is formed on the housing. When the holding member engages the printed substrate, the liquid crystal module is fixed to the printed substrate, and at the same time, the pin electrode of the COF and a through hole electrode of the printed substrate are electrically connected.