Method and apparatus for cutting a laminate made of a brittle material and a plastic

A method and an apparatus for cutting a laminate made of a brittle material and a plastic with a cutting tool is described. The plastic is heated up, thereby lowering its viscosity, at least in the region of a predetermined cutting line. A cutting tool is placed onto the plastic side of the laminate...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	BUERKLE ROLAND, OTTO TORSTEN, HABECK ANDREAS, SCHERER OLIVER
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS CUTTING DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING,CUTTING-OUT, STAMPING-OUT OR SEVERING GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GLASS HAND CUTTING TOOLS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS SEVERING TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A method and an apparatus for cutting a laminate made of a brittle material and a plastic with a cutting tool is described. The plastic is heated up, thereby lowering its viscosity, at least in the region of a predetermined cutting line. A cutting tool is placed onto the plastic side of the laminate, the loading pressure being adjustable. By moving cutting tool relative to the laminate along the predetermined cutting line, the plastic is severed; at the same time the brittle material is scored, thereby inducing a mechanical stress. If appropriate, the mechanical stress along the cutting line is subsequently increased to exceed the rupture strength of the scored brittle material. A preferred application is the cutting of thin glass or glass-ceramic/plastic laminates.