Method for assembling a multi-deck power supply device

A method for assembling a multi-deck power supply device including control and power components. The method comprises providing a first circuit board having a first and a second side. Two prefabricated pin holders are positioned on the first side of the first circuit board. Each pin holder includes...

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Bibliographische Detailangaben
Hauptverfasser:	POYNTON IAN, PERRY MARTY, DIXON DUANE E
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	A method for assembling a multi-deck power supply device including control and power components. The method comprises providing a first circuit board having a first and a second side. Two prefabricated pin holders are positioned on the first side of the first circuit board. Each pin holder includes two threaded inserts, a set of first pins and a set of second pins. The first pins are floating for self-alignment during soldering. After the first pins are soldered on the first side of the first circuit board, a second circuit board is aligned above the first circuit board, and the first and second pins are soldered to the second circuit board. The first pins may include pre-assembled oscillation dampers, such as magnetic material beads.