Low contact force, dual fraction particulate interconnect

A compliant interconnect assembly to electrically connect a first electronic device to a second electronic device comprises a contact set including an electrically insulating flexible film having at least one conductive contact suspended therein. The interconnect assembly also includes a compressible interposer as an electrically insulating elastomer sheet matrix for at least one electrically conducting elastic column to provide a localized conductive path through the thickness of the elastomer sheet. The electrically conducting elastic column comprises a central pillar of conductive spheroidal particles having a first average particle size. The central pillar has a first end opposite a second end. At least the first end has a particulate cap bonded to it including particles having a second average particle size that is less than the first average particle size. The compliant interconnect assembly is formed when the contact set lies adjacent to the compressible interposer to provide engagement between the at least one conductive contact and the at least one conducting elastic column for electrically connecting the first electronic device and the second electronic device abutting opposite sides of the compliant interconnect assembly.