Selective PCB via location to enhance cooling

Disclosed is a printed circuit board (PCB) layout for increasing the ability of the PCB to transfer heat away from a component mounted thereon. The locations of signal vias in the PCB are selected so as to define continuous pathways in a PCB heat sink layer. This allows heat to be effectively conduc...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	BERG MARK, KRAMER ALLEN NICHOLAS
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Disclosed is a printed circuit board (PCB) layout for increasing the ability of the PCB to transfer heat away from a component mounted thereon. The locations of signal vias in the PCB are selected so as to define continuous pathways in a PCB heat sink layer. This allows heat to be effectively conducted away from thermal vias connected to heat sink layer, thereby preventing PCB-mounted components from overheating.