Semiconductor device with layered semiconductor chips
A first semiconductor chip having a pad electrode on its main surface is disposed on a substrate, and a first wiring film electrically connecting the pad electrode to the substrate is further disposed on the substrate so as to cover the first semiconductor chip. A second semiconductor chip is dispos...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | A first semiconductor chip having a pad electrode on its main surface is disposed on a substrate, and a first wiring film electrically connecting the pad electrode to the substrate is further disposed on the substrate so as to cover the first semiconductor chip. A second semiconductor chip is disposed on the first wiring film. The second semiconductor chip has a pad electrode on its main surface opposite to another surface on which the first wiring film is disposed. A second wiring film electrically connecting the pad electrode to the substrate is disposed on the substrate so as to cover the first semiconductor chip and the second semiconductor chip. |
|---|