Multilayer board compound and method for the manufacture thereof

A multilayer printed board compound comprises at least two planely superposed printed boards, each of which having an electrically insulating mother board, electrically conductive circuit paths, which are provided on at least one side of the mother board, and recesses, which are defined laterally by...

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Bibliographische Detailangaben
Hauptverfasser:	OPITZ RUDI W, STUCKMANN WALTER P
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS INDUCTANCES MAGNETS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSFORMERS
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Beschreibung
Zusammenfassung:	A multilayer printed board compound comprises at least two planely superposed printed boards, each of which having an electrically insulating mother board, electrically conductive circuit paths, which are provided on at least one side of the mother board, and recesses, which are defined laterally by the circuit paths and towards the mother board by the mother board; and at least one preimpregnated board, which is disposed between the printed boards for joining the printed boards; wherein the recesses, which are disposed between the mother boards of the respective printed boards, are filled substantially entirely with a synthetic resin paste; and wherein the at least two printed boards and the at least one preimpregnated board are joined by pressing.