Fan duct module
A cooling assembly is disclosed. In one embodiment, the cooling assembly includes a fan for use to direct cool air onto heat dissipating electronic components, and a linear air guiding duct-housing combination for use to house the fan and to guide the cool air to the fan. The linear air guiding duct...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A cooling assembly is disclosed. In one embodiment, the cooling assembly includes a fan for use to direct cool air onto heat dissipating electronic components, and a linear air guiding duct-housing combination for use to house the fan and to guide the cool air to the fan. The linear air guiding duct-housing combination is constituted with material(s) and/or structural supports that allow the cooling assembly to be mounted in a cantilever manner against a chassis wall of a chassis, overhanging the heat dissipating electronic components. In one embodiment, the cooling assembly further includes an air hood coupled to the linear air guiding duct-housing combination to facilitate in-take of cool air from a direction angular to the linear air guiding duct-housing combination. |
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