Packaging substrate comprising staggered vias
A packaging substrate is formed with staggered vias interconnecting fan-out circuitry for improved strength and rigidity. Embodiments of the present invention include substrates wherein less than 20% of the vias are aligned.
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A packaging substrate is formed with staggered vias interconnecting fan-out circuitry for improved strength and rigidity. Embodiments of the present invention include substrates wherein less than 20% of the vias are aligned. |
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