Method for manufacturing a dual chip in package with a flip chip die mounted on a wire bonded die
A method for creating a die that has some bond pads that are compatible with wire bonding and others that are compatible with solder bonding. A layer of copper is disposed over aluminum bond pads and selectively removed from those bond pads that are desired to be compatible with wire bonding.
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A method for creating a die that has some bond pads that are compatible with wire bonding and others that are compatible with solder bonding. A layer of copper is disposed over aluminum bond pads and selectively removed from those bond pads that are desired to be compatible with wire bonding. |
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