Semiconductor chip and a lead frame

A semiconductor chip includes a semiconductor substrate having an electronic circuit theron and a number of bond pads thereon. The bond pads are coupled to the electronic circuit and permit power to be supplied to the electronic circuit and signals to be input to and output from the electronic circuit. The bond pads are arranged on the surface of the substrate such that at least some of the pads are separated from the edge of the substrate by other bond pads. A lead frame is also provided in which two of the contact pins are electrically coupled to each other by a contact strip which extends along at least a portion of an edge of a die pad. The contact strip is located between the die pad and some of the other contact pins.