Wafer support system

An apparatus for processing a substrate comprises a susceptor for supporting the substrate, an upper heat source spaced above the susceptor, a lower heat source spaced below the susceptor, and a controller. The controller provides power to the heat sources at a selected ratio between the sources. Th...

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Bibliographische Detailangaben
Hauptverfasser: JACOBS LOREN R, GLENN HARTMANN, GOODMAN MATTHEW, VAN DER JEUGD CORNELIUS A, VYNE ROBERT M, WENGERT JOHN F, FOSTER DERRICK W, LAYTON JASON M, HALPIN MICHAEL W, HAWKINS MARK R, VAN BILSEN FRANK B. M
Format: Patent
Sprache:eng
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Zusammenfassung:An apparatus for processing a substrate comprises a susceptor for supporting the substrate, an upper heat source spaced above the susceptor, a lower heat source spaced below the susceptor, and a controller. The controller provides power to the heat sources at a selected ratio between the sources. The controller is configured to vary the ratio during a high temperature processing cycle of a substrate to thereby vary the ratio of the heat provided by the heat sources during the cycle.