Microprocessor heat sink retention module

A microprocessor heat sink retention module is described. That module comprises a first frame that has a first side and a second side. The first side is separated from the second side by a distance that is sufficient to enable a microprocessor to fit within the frame. The first and second sides each...

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Bibliographische Detailangaben
Hauptverfasser:	HANES CHRIS H, UNREIN ED, ULEN NEAL
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A microprocessor heat sink retention module is described. That module comprises a first frame that has a first side and a second side. The first side is separated from the second side by a distance that is sufficient to enable a microprocessor to fit within the frame. The first and second sides each have at least one aperture for receiving a microprocessor heat sink. The module also has a heat transfer platform, which is integrated with the first frame. The heat transfer platform comprises a substantially flat metal slab for dissipating heat that is generated by a voltage regulator. Also described are an assembly for a computer and a computer system that include this microprocessor heat sink retention module.