optical measuring system

A three-dimensional measuring module includes an optical chip arranged spatially above a scanning plate and a signal processing assembly arranged above the optical chip. A housing completely encloses the optical chip and the signal processing assembly as well as a scanning plate. The electrical conn...

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Bibliographische Detailangaben
1. Verfasser:	BURGSCHAT REINER
Format:	Patent
Sprache:	eng
Schlagworte:	ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR PHYSICS SEMICONDUCTOR DEVICES TARIFF METERING APPARATUS TESTING
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Beschreibung
Zusammenfassung:	A three-dimensional measuring module includes an optical chip arranged spatially above a scanning plate and a signal processing assembly arranged above the optical chip. A housing completely encloses the optical chip and the signal processing assembly as well as a scanning plate. The electrical connecting lines between the optical chip and the signal processing assembly are routed via the scanning plate and the interior side of the housing to the signal processing assembly. The output signals of the signal processing assembly are conveyed via connecting lines to contacts on the exterior side of the housing. The conductive lines between the optical chip and the signal processing assembly can be kept very short, so that line resistance and interference coupling are reduced.