Method for constructing multilayer circuit boards having air bridges

A multilayer circuit board having air bridge crossover structures and an additive method for producing the same, wherein the circuit includes specially designed metallic fortifying layers to mechanically and/or electrically fortify the circuit.

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Bibliographische Detailangaben
Hauptverfasser:	ACHARI ACHYUTA, ZITZMANN ALICE DAWN, NATION BRENDA JOYCE, MCLESKEY EDWARD, PARUCHURI MOHAN R, BELKE, JR. ROBERT EDWARD, GOENKA LAKHI NANDLAL, LI DELIN
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A multilayer circuit board having air bridge crossover structures and an additive method for producing the same, wherein the circuit includes specially designed metallic fortifying layers to mechanically and/or electrically fortify the circuit.