Method of forming metal contact pads on a metal support substrate
A method of forming low resistance contact pads on a metal support substrate for a multilayer ceramic printed circuit board comprising forming a patterned layer of a conductive metal on the metal support substrate made of the same metal as that used to form the circuitry on the ceramic circuit board...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A method of forming low resistance contact pads on a metal support substrate for a multilayer ceramic printed circuit board comprising forming a patterned layer of a conductive metal on the metal support substrate made of the same metal as that used to form the circuitry on the ceramic circuit board, and firing the support substrate. The patterned conductive metal can be formed by electroplating, by screen printing from a fritless conductor ink or by screen printing from a glass frit-containing conductor ink that includes a reducing agent. |
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