Backside contact for integrated circuit and method of forming same

A contact formed from the backside of an integrated circuit device includes a first conductive layer on a first surface of the integrated circuit device and a second conductive layer on a second surface of the device. The two conductive layers are coupled by way of an opening through the semiconductor substrate separating the two conductive layers. A method for making the backside contact comprises forming the first conductive layer, forming an opening through the semiconductor substrate to expose at least a portion of the underside of the first conductive layer, then filling the opening with a conductive material to provide an electrical contact to the first conductive layer from the backside of the integrated circuit device.