Method to encapsulate bumped integrated circuit to create chip scale package

Method to encapsulate bumped integrated circuit to create chip scale package

An encapsulated bumped die is provided. Singulated bumped dice are attached to a die attach panel. The die attach panel and dice are placed in a mold, where the bumps are partially flattened. A mold compound is then used to encapsulate the dice and panel. The mold compound is cured. The encapsulated...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: MOSTAFAZADEH SHAHRAM
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An encapsulated bumped die is provided. Singulated bumped dice are attached to a die attach panel. The die attach panel and dice are placed in a mold, where the bumps are partially flattened. A mold compound is then used to encapsulate the dice and panel. The mold compound is cured. The encapsulated dice are then singulated. The encapsulated dice may then be directly mounted on a substrate such as a PC board. The encapsulation provides added protection to the dice.