Semiconductor device as an object of thickness reduction

There is provided a semiconductor device which comprises electrode pads formed on an insulating film on a semiconductor substrate, an insulating cover film formed on the insulating film to have openings that expose the electrode pads, and a masking tape having a base material layer and a resist laye...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MURATA KOICHI, WATANABE EIJI, MAKINO YUTAKA, ISHIGURI MASAHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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