Post-mold cooling method and apparatus

The present invention relates to an innovative cooling pin for cooling molded articles, a system which incorporates same, and a method for cooling a molded article which utilizes the cooling pin. The cooling pin of the present invention has a central pin structure with a head portion, a cooling fluid channel within the central pin structure terminating in an outlet in the head portion, and a plurality of fins positioned along the length of the central pin structure. Adjacent ones of the fins are preferably separated by a spacer. Each of the fins is preferably formed from a flexible material such as a flexible plastic material. The fins force and maintain cooling fluid introduced into the interior of the molded article in close proximity to the interior surfaces of the molded article.