Method for filling high aspect ratio via holes in electronic substrates and the resulting holes

Method for filling high aspect ratio via holes in electronic substrates and the resulting holes

High aspect ratio (5:1-30:1) and small (5 mum-125 mum) diameter holes in a dielectric substrate are provided, which are filled with a solidified conductive material, as well as a method of filling such holes using pressure and vacuum. In certain embodiments, the holes are lined with conductive mater...

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Bibliographische Detailangaben
Hauptverfasser: GRUBER PETER ALFRED, MAURER FREDERIC, PAPATHOMAS KONSTANTINOS I, CURCIO BRIAN EUGENE, POLIKS MARK DAVID
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CURRENT COLLECTORS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LINE CONNECTORS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:High aspect ratio (5:1-30:1) and small (5 mum-125 mum) diameter holes in a dielectric substrate are provided, which are filled with a solidified conductive material, as well as a method of filling such holes using pressure and vacuum. In certain embodiments, the holes are lined with conductive material and/or capped with a conductive material. The invention also contemplates a chip carrier formed by such material.