Tear-away package opening

The present invention is directed to a package having a tear-away opening. The package comprises an outer substrate layer, an inner aseptic layer secured to the outer substrate layer, and a cut in the outer substrate layer. In order to preserve the product in the package, the cut is of a predetermined depth such that the cut does not puncture the inner aseptic layer. The cut, however, is sufficiently deep so that a predetermined portion of the package may be torn off at the cut. The present invention also includes methods for manufacturing and opening a package having a tear-away opening. The method for manufacturing a package having a tear-away opening generally includes the steps of providing an outer substrate layer, securing an inner aseptic layer to the outer substrate layer, making a cut of predetermined depth in the outer substrate layer such that the cut does not puncture the inner aseptic layer, and then forming a package. After the package has been formed, a predetermined portion of the package may be torn away at the cut. The method for opening a package having a tear-away opening is initiated by extending a flap from a side of the package. After the flap is extended, at least a portion of a joint is extended from the top and the flap. At least a portion of the top is then moved in a direction away from the bottom of the package. After the top is moved, a predetermined portion of the package may be torn off at the cut.