Semiconductor module and inverter device

In a semiconductor module comprising, a semiconductor element, an electrically insulating base having an outer surface to be connected to an electrically grounded surface, and an inner surface on which the semiconductor element is arranged, an electrically insulating cover covering the semiconductor...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KUSHIMA TADAO, NONOYAMA SHIGEHARU, TANAKA AKIRA, KOIKE YOSHIHIKO, SAITO RYUICHI, SHIMIZU HIDEO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:In a semiconductor module comprising, a semiconductor element, an electrically insulating base having an outer surface to be connected to an electrically grounded surface, and an inner surface on which the semiconductor element is arranged, an electrically insulating cover covering the semiconductor element on the inner surface, and first and second electrically conductive members each of which is connected to the semiconductor element and extends to the exterior of the semiconductor module through the electrically insulating cover, a part of each of the first and second electrically conductive members on the exterior of the semiconductor module is arranged away from the outer surface to electrically isolate the part of the each of the first and second electrically conductive members from the electrically grounded surface.