Halo-free non-rectifying contact on chip with halo source/drain diffusion

A semiconductor chip includes a semiconductor substrate having a rectifying contact diffusion and a non-rectifying contact diffusion. A halo diffusion is adjacent the rectifying contact diffusion and no halo diffusion is adjacent the non-rectifying contact diffusion.The rectifying contact diffusion...

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Bibliographische Detailangaben
Hauptverfasser: CULP JAMES A, SHERONY MELANIE J, NAYAK JAWAHAR P, RAUSCH WERNER A, VOLDMAN STEVEN H, ZAMDMER NOAH D
Format: Patent
Sprache:eng
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Zusammenfassung:A semiconductor chip includes a semiconductor substrate having a rectifying contact diffusion and a non-rectifying contact diffusion. A halo diffusion is adjacent the rectifying contact diffusion and no halo diffusion is adjacent the non-rectifying contact diffusion.The rectifying contact diffusion can be a source/drain diffusion of an FET to improve resistance to punch-through. The non-rectifying contact diffusion may be an FET body contact, a lateral diode contact, or a resistor or capacitor contact. Avoiding a halo for non-rectifying contacts reduces series resistance and improves device characteristics. In another embodiment on a chip having devices with halos adjacent diffusions, no halo diffusion is adjacent a rectifying contact diffusion of a lateral diode, significantly improving ideality of the diode and increasing breakdown voltage.