Chip C4 assembly improvement using magnetic force and adhesive

A structure that adhesively couples a chip to an organic chip carrier. The chip is attached to a top surface of the organic chip carrier by interfacing a solder bump between a C4 solder structure on the chip and a pad on a top surface of the chip carrier. The melting temperature of the solder bump is less than the melting temperature of the C4 solder structure. A block of ferrous material is on a top surface of the chip. A temporary or permanent stiffener of ferrous material is on the top surface of the chip carrier. A permanent magnet is coupled to a bottom surface of the chip carrier. Alternatively, an electromagnetic could be utilized instead of the electromagnet. Due to the permanent magnet or the electromagnet, a magnetic force on the stiffener is directed toward the magnet and substantially flattens the first surface of the chip carrier. Similarly, a magnetic force on the block is directed toward the magnet such that the electronic component and the chip carrier are held in alignment. After the solder bump has been reflowed at a temperature between the melting temperature of the solder bump and the melting temperature of the C4 solder structure, the solder bump is reconfigured. The magnetic force on the block frictionally clamps the reflowed solder between the C4 solder structure and the pad. After the chip and carrier are cooled, the C4 solder structure is adhesively and conductively coupled to the pad.