Apparatus and method for padding the ground below a duct using excavated soils, equipment for compacting soil below a duct, and a soil-compacting mechanism

The present invention relates to a method for padding ground below a duct (1) using excavated soil (2), wherein said method uses a vehicle (6) that comprises a soil feeding organ (13), a transport organ (14) and soil compacting organs (104, 105). The vehicle moves along a ground path (16) which is f...

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Hauptverfasser: MAMONTOV JURY M, SCHIPKOVSKY ALEXEY N, KUMYLGANOV ALEXANDR S, VASILENKO STANISLAV K, MUSIIKO VLADIMIR D, MOVCHAN ALY A, CHERNAEV VALERY D, BYKOV ALEXANDR V, KOVAL ANDREI B, YAKOVLEV VIKTOR I, LEICHENKO JURY B
Format: Patent
Sprache:eng
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Zusammenfassung:The present invention relates to a method for padding ground below a duct (1) using excavated soil (2), wherein said method uses a vehicle (6) that comprises a soil feeding organ (13), a transport organ (14) and soil compacting organs (104, 105). The vehicle moves along a ground path (16) which is formed by the soil feeding organ (13) as it collects excavated soil (2). This method allows for a reliable orientation of the soil compacting organs (104, 105) relative to the duct (1), wherein said compacting organs apply a force on the soil previously deposited in the trench (4). This invention also relates to a device which is used for padding ground below a duct (1) and comprises a device (106) for hanging a soil-compacting mechanism (103) to the vehicle (6). The device (106) includes a disconnection mechanism (153) that enables the cyclic displacement of the rammer-type compacting organs (104, 105) in the displacement direction of the vehicle (6). When compacting soil, the working members (171) of the compacting organs (104, 105) are capable of cyclic downward displacement towards each other while simultaneously rotating in a direction in which the angle they define becomes smaller. This system may be used for efficiency compacting soil below a duct (1) while minimising the stress applied by the soil to the surface of said duct (1).