Connecting method of resin material molded product, process cartridge and assembling method of process cartridge

A bonding method for bonding molded resin products, includes the step of bonding a first one of the molded resin products and a second one of the molded resin products by injecting resin material through a resin material injection path to a bonding portion therebetween, wherein the resin material in...

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Bibliographische Detailangaben
Hauptverfasser:	MIYABE SHIGEO, SASAKI SHINICHI, TSUDA TADAYUKI, SUZUKI AKIRA, HIRATSUKA KOUICHI, ABE KENSHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CINEMATOGRAPHY ELECTROGRAPHY ELECTROPHOTOGRAPHY HOLOGRAPHY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS MAGNETOGRAPHY PERFORMING OPERATIONS PHOTOGRAPHY PHYSICS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A bonding method for bonding molded resin products, includes the step of bonding a first one of the molded resin products and a second one of the molded resin products by injecting resin material through a resin material injection path to a bonding portion therebetween, wherein the resin material injection path is formed in one of or both of the first resin material molded product and the second resin material molded product.