Protective cover and attachment method for moisture sensitive devices

A radiation imaging device includes a scintillator, a cover and an imager substrate. A photodetector array comprising a plurality of photodetectors is disposed on the imager substrate. The cover is hermetically bonded to the substrate with a sealant. The cover has outer sidewalls and a top side conn...

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Bibliographische Detailangaben
Hauptverfasser:	MAYDANICH FYODOR I, SHVETSKIY YAKOV
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASUREMENT OF NUCLEAR OR X-RADIATION MEASURING PHYSICS PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	A radiation imaging device includes a scintillator, a cover and an imager substrate. A photodetector array comprising a plurality of photodetectors is disposed on the imager substrate. The cover is hermetically bonded to the substrate with a sealant. The cover has outer sidewalls and a top side connecting the outer sidewalls. In attaching to the substrate, the cover is disposed on the imager substrate to surround the scintillator. A curable sealant is applied along the outer surface of the cover. The sealant is then cured to hermetically bond the cover to the substrate.