Method of forming dummy metal pattern
A method of forming a dummy metal pattern for manufacturing an interconnect pattern. The invention forms a dummy metal pattern on a wafer having a fixed layout while fabricating an interconnect so as to make uniform the metal line pattern on the wafer. Thus, a loading effect can be avoided to benefi...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A method of forming a dummy metal pattern for manufacturing an interconnect pattern. The invention forms a dummy metal pattern on a wafer having a fixed layout while fabricating an interconnect so as to make uniform the metal line pattern on the wafer. Thus, a loading effect can be avoided to benefit a subsequent process, device reliability can be enhanced, and yield can also be increased. |
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