Microelectronic contact assembly

An electronic interconnect includes a flexible circuit which has a plurality of contacts formed thereon. A plurality of springs is positioned so as to apply a compressive force to at least one of the contacts when the electronic interconnect is mated. A resilient material is configured to apply a co...

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Bibliographische Detailangaben
Hauptverfasser: SCHREIBER CHRIS M, SZALAY JOHN STEVEN
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:An electronic interconnect includes a flexible circuit which has a plurality of contacts formed thereon. A plurality of springs is positioned so as to apply a compressive force to at least one of the contacts when the electronic interconnect is mated. A resilient material is configured to apply a compressive force to at least one of the springs.