Method and apparatus for cooling electronic components

The present invention discloses improved cooling designs and methods for the cooling of heat sources. One embodiment of the present invention is a cooling system comprising a housing and at least one divider disposed within the housing. The at least one divider creates a plurality of airflow channels through the housing. Another embodiment of the invention is a method for dissipating heat from heat sources within an electrical assembly comprising at least partially separating the heat sources with a divider. Separate airflow channels are created whereby the separated heat sources are disposed within the separated airflow channels. Forced airflow streams are generated through the separated airflow channels, thereby dissipating heat from the heat sources into the forced airflow streams.