Wire bond compensation

A hybrid circuit and a process for the manufacturing of a hybrid circuit (11) have been provided, the circuit comprising a component (2) such as a monolithic integrated circuit, MIC, and a substrate (1), being arranged on a common carrier plate (6), the substrate and component having respective terminals (3, 3', 4, 4', 4''). The hybrid circuit furthermore comprises a pad (7, 7', 7'', 12, 13) mounted on the substrate terminal (3, 3'), whereby the pad is extending over the edge of the substrate terminal and facing the terminal (4, 4', 4'') of the component, and at least one bonding element (8, 8', 8'') or other connecting element being provided between the terminal (4) of the component and the pad (7, 7', 7'', 12, 13). The connection according to the invention provides for a very low impedance value, which can be produced accurately, reliably and economically.