Laser diode assembly

An improved laser diode assembly and a method of making such an assembly are provided. The assembly has a substrate wherein channels are formed to receive laser diodes. The channels have an inwardly tapering shape, with a first side wall generally perpendicular to the front surface of the substrate and a second side wall at an angle with the first side wall. A metallic coating is provided over the front surface and the side walls of the channels, with a break at the bottom of the channels. Laser diode bars are mounted along the first side wall of each channel, and a conductive body such as a metallic wire is wedged between the laser diode bar and the opposite tilted side wall. The laser diode bars and wires are held in place by a solder layer. Advantageously, this assembly can be manufactured with less stringent fabrication tolerances than with known laser diode arrays.