Apparatus for cooling heat generating devices

A computer system including a chassis having a printed circuit substrate mounted thereon. A plurality of microprocessors are mounted on the printed circuit substrate. A first one of the microprocessors is mounted in an in-line configuration with respect to a second one of the microprocessors. A heat dissipating device is mounted on each one of the microprocessors. The heat dissipating device mounted on the first one of the microprocessors includes a first heat dissipating body positioned at a first elevation above a mounting surface of the printed circuit substrate. The heat dissipating device mounted on the second one of the microprocessors includes a second heat dissipating body positioned at a second elevation above the mounting surface of the printed circuit substrate. A fan is mounted on the chassis adjacent to the printed circuit substrate for directing a stream of air over at least a portion of the first and the second heat dissipating bodies. Each heat dissipating body is subjected to a substantially unheated stream of air, improving cooling efficiency.