$Modification of in-plate refractory metal texture by use of refractory metal/nitride layer$

Modification of in-plate refractory metal texture by use of refractory metal/nitride layer

A method for achieving, and a structure containing, a thin film refractory metal with a generally symmetric microstructual morphology. Incorporation of between 1 and 5% by atomic fraction nitrogen into the refractory metal selected from the group of Ti, V, Cr, Nb, Mo, Ta, W and alloys thereof result...

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Bibliographische Detailangaben
Hauptverfasser:	RODBELL KENNETH PARKER, TAKATSUJI HIROSHI, COLGAN EVAN GEORGE, HARPER JAMES MCKELL EDWIN
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A method for achieving, and a structure containing, a thin film refractory metal with a generally symmetric microstructual morphology. Incorporation of between 1 and 5% by atomic fraction nitrogen into the refractory metal selected from the group of Ti, V, Cr, Nb, Mo, Ta, W and alloys thereof results in the desired structural morphology and electrical resistance. Multi-layer structures can be built up of alternate layers of refractory metal with and without nitrogen to achieve a desired product. Alternate layers can vary in thickness and nitrogen content.