Low dielectric constant materials with improved thermal and mechanical properties

New starting materials and methods are used to make materials with low dielectric constant through the processes of transport polymerization or chemical vapor deposition. The starting materials and precursors are designed to provide polymers with combined low dielectric constant, high thermal stabil...

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Bibliographische Detailangaben
Hauptverfasser: FOGGIATO GIOVANNI ANTONIO, LEE CHUNG J, WANG HUI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:New starting materials and methods are used to make materials with low dielectric constant through the processes of transport polymerization or chemical vapor deposition. The starting materials and precursors are designed to provide polymers with combined low dielectric constant, high thermal stability and high mechanical strength.