Reflow selective shorting

Reflow selective shorting

A bridge structure is utilized on a circuit board. The bridge structure includes a first element, a second element and a gap between the first element and a second element. Soder paste is capable of flowing when the circuit board is heated, such that the paste on the first element comes into contact...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ZORN TODD J, BYLE FRANCIS R, MCCOY KEVIN M
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CURRENT COLLECTORS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LINE CONNECTORS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:A bridge structure is utilized on a circuit board. The bridge structure includes a first element, a second element and a gap between the first element and a second element. Soder paste is capable of flowing when the circuit board is heated, such that the paste on the first element comes into contact with paste on the second element. The paste solidifies when cooled such that solidified paste serves to connect the first element and the second element. The first and second elements can be L-shaped.