Extended surface area heat sink

A heat sink for cooling a high power consumption device, such as a central processing unit (device), has extended heat transfer areas. In an embodiment, the extended heat transfer areas may include fins protruding from portions of a heat sink base. The extended heat transfer area of the heat sink may overhang an area of a circuit board adjacent to the high power consumption device. Low power consumption components, such as memory chips, can be mounted on the circuit board in close proximity to the high power consumption device and beneath the heat sink. The low power consumption component may have separate heat sinks that attach to the low power consumption components and extend beyond the base of the high power consumption device heat sink.