Separation of a multi-layer integrated circuit device and package

Aspects for device and package separation of a multi-layer integrated circuit device attached at a frontside to an integrated circuit package are described. In an exemplary method aspect, the method includes cutting through coupling material between the multilayer integrated circuit and the integrated circuit package with a high precision saw blade. The method further includes cutting with a high precision saw blade of approximately 50 microns thickness. Additionally, the multi-layer integrated circuit device is utilized for device analysis from a frontside following separation from the integrated circuit package by the step of cutting.